Research Staff Member-Signal Integrity and High-Frequency Packaging
INTRODUCTION
IBM Research Scientists are charting the future of Artificial Intelligence, creating breakthroughs in quantum computing, discovering how blockchain will reshape the enterprise, and much more. Join a team that is dedicated to applying science to some of today's most complex challenges, whether it's discovering a new way for doctors to help patients, teaming with environmentalists to clean up our waterways or enabling retailers to personalize customer service.
YOUR ROLE AND RESPONSIBILITIES
IBM is seeking a Research Staff Member to work at its Yorktown Heights, NY location. At IBM Research, we are conceptualizing and prototyping innovative high-speed interconnect, analog/mixed signal, and RF (Radio frequency) solutions for future computing, storage, networking, wireless and quantum computing systems. Your role will span the areas of signal integrity (SI) analysis, high-frequency packaging design and characterization, high-frequency interconnect design and characterization, multi-chip module (MCM) design, and electromagnetic (EM) modeling. Specific examples of interconnects, packages and modules that you will help develop include, among others: electro-optic and SerDes interconnects; MCM modules consisting of advanced processors; memory and accelerator components; RF packages/interconnects, and interconnects for quantum electronics. Specific responsibilities may include: defining and modeling advanced high-frequency MCM and interconnects; collaborate with board, IC, and, system researches to drive complete MCM designs while owning EM and SI analysis; solve SI challenges with IC, PCB and package physical design (layout engineers); and perform high-frequency SI and s-parameter measurements on interconnect breakouts and complete modules.
You will be part of a team that demonstrates new research concepts and works closely with system partners to both define roadmaps and transition successful concepts into product. You must be able to work successfully and collaboratively with a diverse and dynamic team. PhD degree in Electrical Engineering or a related area is required.
REQUIRED TECHNICAL AND PROFESSIONAL EXPERTISE
PREFERRED TECHNICAL AND PROFESSIONAL EXPERTISE
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