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Research Staff Member-Signal Integrity and High-Frequency Packaging

IBM

IBM

Research Staff Member-Signal Integrity and High-Frequency Packaging

Yorktown Heights, NY
Full Time
Paid
  • Responsibilities

    INTRODUCTION

    IBM Research Scientists are charting the future of Artificial Intelligence, creating breakthroughs in quantum computing, discovering how blockchain will reshape the enterprise, and much more. Join a team that is dedicated to applying science to some of today's most complex challenges, whether it's discovering a new way for doctors to help patients, teaming with environmentalists to clean up our waterways or enabling retailers to personalize customer service.

    YOUR ROLE AND RESPONSIBILITIES

    IBM is seeking a Research Staff Member to work at its Yorktown Heights, NY location. At IBM Research, we are conceptualizing and prototyping innovative high-speed interconnect, analog/mixed signal, and RF (Radio frequency) solutions for future computing, storage, networking, wireless and quantum computing systems. Your role will span the areas of signal integrity (SI) analysis, high-frequency packaging design and characterization, high-frequency interconnect design and characterization, multi-chip module (MCM) design, and electromagnetic (EM) modeling. Specific examples of interconnects, packages and modules that you will help develop include, among others: electro-optic and SerDes interconnects; MCM modules consisting of advanced processors; memory and accelerator components; RF packages/interconnects, and interconnects for quantum electronics. Specific responsibilities may include: defining and modeling advanced high-frequency MCM and interconnects; collaborate with board, IC, and, system researches to drive complete MCM designs while owning EM and SI analysis; solve SI challenges with IC, PCB and package physical design (layout engineers); and perform high-frequency SI and s-parameter measurements on interconnect breakouts and complete modules.

    You will be part of a team that demonstrates new research concepts and works closely with system partners to both define roadmaps and transition successful concepts into product. You must be able to work successfully and collaboratively with a diverse and dynamic team. PhD degree in Electrical Engineering or a related area is required.

  • Qualifications

    REQUIRED TECHNICAL AND PROFESSIONAL EXPERTISE

    • Experience in high-frequency packaging and SI design -1 year
    • Experience in test and evaluation of high frequency interconnects -1 year
    • Proven knowledge of EM modeling and SI analysis tools -1 year

    PREFERRED TECHNICAL AND PROFESSIONAL EXPERTISE

    • Experience with high-speed serializer and de-serializer communication modules
    • Advanced understanding of signal integrity and impedance matching considerations in the context of high speed wired/wireless design
    • Experience with characterization of wireless communication modules
    • Experience in the development of novel solution/approaches to high-frequency packaging problems
    • Experience in working with multi-disciplinary teams
  • Industry
    Information Technology and Services
  • About Us

    IBM’s greatest invention is the IBMer. We believe that through the application of intelligence, reason and science, we can improve business, society and the human condition, bringing the power of an open hybrid cloud and AI strategy to life for our clients and partners around the world.

    Restlessly reinventing since 1911, we are not only one of the largest corporate organizations in the world, we’re also one of the biggest technology and consulting employers, with many of the Fortune 50 companies relying on the IBM Cloud to run their business.

    At IBM, we pride ourselves on being an early adopter of artificial intelligence, quantum computing and blockchain. Now it’s time for you to join us on our journey to being a responsible technology innovator and a force for good in the world.