BE MFG intern Folsom, CA -Job ID:JR0066458 Job Category:Intern/Student Primary Location:Folsom, CA US Other Locations: Job Type:Intern -BE MFG internJob Description The candidate will be based in Folsom, CA supporting Intel NSG Backend Manufacturing financial processes. The role will focus on operational support and improvement of the manufacturing organization's capital expenditure and purchase order processes. In the role, the candidate will evaluate, maintain, and ultimately propose systematic improvements across mutliple financial reporting/consoldiation processes Responsibilities may be quite diverse in a technical nature and will vary significantly depending on the unique needs of the role, U.S. experience and education requirements. Job assignments may be for the summer or for short periods throughout the school year. The responsibilities will include, but are not limited to the following: -Capital expenditure plan management and tracking system development -Purchase order request management and development of systematic scheduling/monitoring/approval process -Process of NPV and ROI analysis of various projects -Identifying process gaps in critical financial indicators supplier level comparision/tracking, indicator development, program level visibility and trend, etc -Coordination across US and Asia based stakeholders, inclusive of PO generation gap analysis. Qualifications You must possess the minimum qualifications to be initially considered for this position. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience. Minimum Requirements: -Must be pursuing BS Finance, Supply Chain or related field. -Must have unrestricted right to work in the US without requiring sponsorship. Preferred Qualifications: -Experience in office process improvements and/or standardization Lean, 5S, etc. -PO management standarization. -NPV analisys. Inside this Business Group Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing. Posting Statement.Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.