Job Description
1. Wet Process (Electroplating, Liftoff and Wet etch) owner in a high-volume 24x7 wafer fabrication environment.
2. Responsible for chemical analysis for the chemicals used in the wet processes (Electroplating, Liftoff and Wet etch).
3. Responsible for implementing, maintaining, and optimizing SPC/APC process control schemes.
4. Responsible for the disposition of wafers on hold following specifications and establishing out-of-control action plans.
5. Responsible for performing failure analysis on defective wafers and implementing corrective and preventive actions.
6. Focal point for continuous process improvement working with various teams: Manufacturing, Equipment Engineering, Process Engineering, Vendors, Development, etc.
7. Responsible for achieving yield, cost, and cycle time goals.
8. Key role supporting new product design / development / integration / qualification, and production ramp up.
9. Responsible for introducing and qualifying new equipment, materials, and processes.
10. Responsible for documenting procedures, specifications, process changes, etc. and for providing training to manufacturing personnel.
Qualifications
Additional Information
All your information will be kept confidential according to EEO guidelines.