Job Description We are seeking highly motivated students to be a part of our RAMP (Summer Intern) program. These paid summer internship opportunities are designed to jump start your career, offering on-the-job training and a robust summer of events. As a RAMP participant, you'll work alongside technology industry professionals on real-world projects, giving you the tools and experience to get your career off the ground. Additionally, Ramp participants will attend networking events, participate in workshops, and present to the WD leadership team. Working closely with Wafer Fab Team, Product and Test Engineering team, and Wafer Level Reliability (WLR) Team to enable technology qualification, to speed up yield ramp, and drive defective parts per million (DPPM) improvement through WLR evaluation. ESSENTIAL DUTIES AND RESPONSIBILITIES: Collaborating with Quality Assurance team on establishing standard procedure for fab process and test program changes; Driving and addressing any fab process related product problems or concerns as the point of contact in Product and Test Engineering; Defining and developing strategies and methodologies to bring leading edge 3D NAND Flash memory to market by meeting stringent DPPM, reliability, and yield requirements; Improving group working efficiency by initiation and implementation of automations using various complex software and tools; Defining test flow and screens to deliver high quality original equipment manufacturer (OEM) products meeting DPPM targets; Performing Failure Analysis, defining root causes of yield loss, and driving for improvements in the test flow; Interfacing with design, process, test, and reliability engineering to solve complex problems; Sustaining products with cost reduction and yield improvements. Bridging communications between offshore team lead/engineers and US product teams, as well as supporting interaction with customers. REQUIRED: Current student, pursuing a Master of Ph.D. degree in Electrical Engineering, Physics, Computer Science, or related fields and graduating between December 2020 and June 2021 Minimum of 3.0 GPA Exceptional written and verbal communication skills Strong technical skills in area of study Interest in HDD, flash, semiconductor, components, nonvolatile memory industry Interest in electronics, or analog/digital circuitry Proficient in Microsoft Office applications Experience using programming languages: C/C++, Python, Perl