Hardware Intern 2027: Advanced Solder Processes

IBM

Hardware Intern 2027: Advanced Solder Processes

Yorktown Heights, NY
Internship
Paid
  • Responsibilities

    Job Title

    Hardware Intern 2027: Advanced Solder Processes

    Date posted

    30-Sep-2026

    Job ID

    134618

    City / Township / Village

    Yorktown Heights

    State / Province

    New York

    Country

    United States

    Work arrangement

    Onsite

    Area of work

    Infrastructure & Technology

    Employment type

    Co-Op (Fixed Term)

    Contract type

    Internship

    Projected Minimum Salary per year

    88,200.00

    Projected Maximum Salary per year

    161,700.00

    Position type

    Internship

    Travel required

    No Travel

    Company

    (0147) International Business Machines Corporation

    Shift

    General (daytime)

    Is this role a commissionable/sales incentive based position?

    No

  • Industry
    Technology