Job Description

The ability to work in an ESD environment.

·         The ability to bring concerns up though a standardized chain of command.

·         Ability to handle and process delicate materials in chip or wafer form.

·         Skilled hand-eye coordination is imperative for proper handling and movement of parts.

·         Experience with aspects of this film processing including but not limited to substrate separation/handling, circuit cleaning/handling or visual inspection desired.

·         Previous experience with solder, epoxy and wire bonding is desired.

·         Experience with inspection at 50x, 100x and 600x.

Qualifications

·        

Additional Information

 We are unable to sponsor at this time