PURPOSE:

Under the direct supervision of the cleanroom lead, the Process Technician will be responsible for Die Attach and Wire Bonding activities.

 

PRINCIPLE ACCOUNTABILITIES / DUTIES:

• Set-up and operation of wire bond and die attach machine with speed and accuracy for processing and testing high volumes of parts
• Identify and report process deviations to engineer and manager
• Experience in setting up and running automated wire bonding and Die attach equipment
• Strong inspection skills (must be able to pay close attention to details)
• Technician must demonstrate flexibility and the ability to learn new skills, they are required to train and learn new products and processes
• Will be responsible for ensuring quality of work

 

PREVIOUS EXPERIENCE REQUIRED: (include experience required with specific software applications, equipment, or specific certifications and education requirements such as MSME, MSEE, APICS, etc)

• Needs to be a detail oriented individual and have the ability to demonstrate fine motor skills with small parts
• Ability to use small tools and with great attention to detail
• Ability to Read, Write, Speak, and comprehend English
• Ability to follow verbal and written work instruction
• Must have good interpersonal skills and have the ability to work in a team environment.
• Soldering experience highly desired
• Basic Computer skills required
• Inspection of products may be required
• Critical thinking and problem-solving skills

 

PREFERRED Qualifications (nice to have skills): • Previous manufacturing/assembly experience preferred
• Previous wire bonding (ASM or Delvotec) experience preferred
• Previous Die Attach (MRSI, Datacon or Finetech) experience a plus
• Clean Room Experience a plus

Education or Training: DIPLOMA, CERTIFICATE Associate’s Degree in Engineering Tech or related field