Job Description

Director, Wafer Processing Services

About Fabrinet

Fabrinet provides advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products such as optical communication components, modules, and sub-systems, industrial lasers, automotive components, medical devices and sensors. We offer a broad range of advanced capabilities across the entire manufacturing process, including process design and engineering, supply chain management, precision optical and glass component fabrication, complex printed circuit board assembly, advanced packaging, integration, final assembly and testing. Our facilities comprise approximately 2.1 million square feet, including 1.6 million square feet in Thailand and the balance in China, the United States, the United Kingdom and Israel. Fabrinet is a publicly traded company with annual revenue of approximately USD 1.6 billion and more than 11,000 employees. For more information, visit www.fabrinet.com.

Position Summary:

Fabrinet is seeking a senior level, qualified individual to direct the wafer processing unit and introduce and drive advanced semiconductor wafer technologies and capabilities. Individual must be highly competent in a wide range of semiconductor processes and have extensive direct experience introducing new technologies to a manufacturing services environment. The role will entail close interaction with the customer, executives and operations teams. This position will also be responsible for managing OSAT and foundry partners to support wafer bumping, UBM and other interconnect solutions to support multi-chip bonding processes. The position is based at Fabrinet’s Santa Clara, CA, USA location and will require frequent travel to Fabrinet’s overseas facilities.

Reporting:

The position will report directly to the COO

Essential Duties and Responsibilities:

• Grow the front-end semiconductor and wafer processing services business.
• Introduce and drive new front-end semiconductor process technologies and capabilities to a manufacturing services environment.
• Stay up-to-date with and assess semiconductor industry process trends. Plan 5 year technology roadmap to align with customer needs and develop the best in class process capabilities.
• Cap Ex planning and potential revenue assessment of new technologies and equipment.
• Work closely with internal teams on facility and regulatory requirements associated with new semiconductor processes.
• Provide direction to internal operations teams to manage customers’ wafer processing needs and workflows. (Cu pillars, UBM, wafer testing etc.)
• Support business development and internal operation teams on technical customer interactions to promote Fabrinet’s wafer processing services and capabilities.
• Regular progress reports to senior management and board.
• Perform related work as assigned

Experience

• Highly competent, direct experience in a wide range of semiconductor processes including photolithography, deposition (electroplating, vapor deposition, evaporation, sputtering), material removal (wet and dry etch, DRIE, KOH), polishing (CMP) and thermal treatments.
• Experience with flip chip technologies, bumping, wafer level chip scale processing, 2.5 and 3D integrated circuits, interposers, through silicon vias/through glass vias, redistribution layers, heterogeneous bonding, MEMS based optical sensors, silicon photonics and photonic integrated circuits based on silicon and III-V materials
• Deep understanding of wafer level packaging requirements and challenges including but not limited to wafer bumping (Cu pillar), RDL, TSV, etc.
• Wafer processing equipment and process controls: Scrubber, Electroplating, PVD, PR Coater, Steppers, PR Strip, plasma cleaning, UBM etching, wafer sorter, 2D/3D AOI etc.
• Wafer level failure analysis with structural and material analysis expertise (SEM /FIB/EDX/FEI/FTIR/CSAM etc.)
• Direct experience managing both domestic and off-shore factory assets and teams and ability to travel to overseas facilities.
• Have formed and trained engineering teams to support operations and customer New Product Development,
• Experience supporting Design for Manufacturing and Test solutions.
• Self-driven, highly motivated individual with ability to multi-task and manage multiple high-technology projects.
• Excellent written and verbal communication skills, including strong English public speaking ability. Solid customer services skills and adept at giving technical presentations.
• Project management skills with a track record of managing and on-time delivering from NPI to mass production.
• Cost accounting to plan, manage and deliver P&L

Qualifications:

• Master’s Degree or Doctorate in Engineering or Physics is preferred.
• 10+ years’ of work experience in wafer processing technologies.
• Experience in the contract foundry services, MEMS or OSAT industries specifically on optical sensing and photonic applications in optical communications, optical sensors like LiDAR, high complexity automotive sensors and biomedical devices.
• Experience with advanced packaging processes including wafer grinding, dicing, die attach, wire bonding and advanced optical packaging is preferred
• Familiarity with the advanced electronics manufacturing services (EMS) industry is preferred

TRAVEL TO THAILAND REQUIRED 25%+ per quarter

FabrinetWest including its subsidiaries, is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, national origin, sex, sexual orientation, gender identify, age, disability, genetic information, veteran status, or any other characteristic protected by law.