Failure Analysis Engineer
Location: Fort Worth Alliance, TX
Employment Type: Full-Time
Position Summary The Failure Analysis Engineer (FAE) is responsible for investigating, analyzing, and identifying root causes of
failures in electronic assemblies, systems, and components used in high-performance computing, server, and AI- related hardware products. This role supports continuous improvement and product reliability initiatives
through data-driven analysis, cross-functional collaboration, and corrective action implementation. The FAE will leverage advanced diagnostic tools and methods to enhance product quality, manufacturing yields, and customer satisfaction
Supervisory Responsibilities • May oversee FA Technicians and provide technical guidance and training. • Coordinates project assignments and ensures timely completion of analysis reports. Key Responsibilities Failure Analysis and Root Cause Investigation (50%) • Perform electrical, mechanical, and thermal failure analysis on defective units from production, field returns (RMA), and reliability testing. • Utilize analytical tools such as oscilloscopes, X-ray, SEM/EDS, decapsulation, and cross-sectioning for detailed investigation. • Identify failure modes, document analysis results, and establish root cause and contributing factors. • Correlate failures with design, process, and material data to support engineering improvements. Data Collection and Reporting (20%) • Maintain detailed FA reports, including findings, corrective actions, and risk assessments. • Present analysis summaries to internal engineering, manufacturing, and customer teams. • Compile trend data on recurring failure modes and propose mitigation actions. • Track metrics on failure rates, mean time between failure (MTBF), and reliability indicators.
JOB DESCRIPTION Cross-Functional Collaboration (15%) • Partner with manufacturing, R&D, and quality engineering teams to drive corrective and preventive actions (CAPA). • Support supplier quality teams in component failure validation and incoming inspection processes. • Coordinate with customer support and warranty analysis teams on field failure investigations. Process and Product Improvement (10%) • Participate in Design for Manufacturability (DFM) and Design for Reliability (DfR) reviews. • Recommend design or process modifications to reduce defect rates and improve overall product robustness. • Contribute to process control documentation and standard operating procedures (SOPs). Compliance and Safety (5%) • Ensure all FA activities comply with ESD, ISO, and environmental standards (e.g., RoHS, REACH). • Maintain lab equipment calibration and safe operating practices.
Education: • Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field required. • Master’s degree or equivalent experience in Reliability Engineering, Failure Analysis, or Quality Engineering preferred.
Experience: • 3–5 years of experience in failure analysis or reliability engineering within electronics, semiconductor, or high-tech manufacturing industries. • Experience with AI server systems, GPU boards, or data center hardware is a plus. Technical Skills: • Proficiency with diagnostic equipment (oscilloscope, DMM, logic analyzer, X-ray, SEM, FIB, etc.) • Knowledge of SMT manufacturing, solder joint analysis, and IPC standards. • Familiarity with reliability testing (HALT, HASS, thermal cycling, vibration testing). • Experience with data analysis tools (Python, JMP, Minitab, Excel). • Ability to interpret schematics, layout drawings, and bill of materials (BOM). Core Competencies • Analytical Thinking: Strong ability to dissect complex problems and identify root causes. • Technical Expertise: Deep understanding of electrical/electronic systems, PCB design, and semiconductor behavior. • Collaboration: Works effectively with multidisciplinary teams to solve technical challenges. • Communication: Ability to write clear, data-supported reports and present findings to technical and non-technical audiences. • Continuous Improvement: Passion for enhancing product reliability and manufacturing efficiency Performance Indicators (KPI’s) • Failure Analysis Turnaround Time (TAT) • Root Cause Accuracy and Verification Rate • Corrective Action Implementation Effectiveness • Reduction in Recurrence Rate of Failures • Customer Satisfaction (internal/external) with FA deliverables Working Conditions • On-site role at Wistron’s Alliance, TX manufacturing facility. • Exposure to electronics lab environments (ESD-safe areas, microscopes, soldering stations). • Occasional travel to suppliers, customer sites, or corporate headquarters (domestic/international). • Normal working hours with flexibility to support urgent FA cases and project deadlines.