The Wet Etch & Clean Process Development Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications.

Provide effective pass-downs to support uninterrupted operation for Wet Etch and Clean activities.

Sustain existing processes in the areas of, pre-diffusion clean, post ash clean, SC1, RCA, metal strip, SPM etch, vapor HF for post-poly-silicon polymer clean, solvent polymer removal, resist strip, silicon etch, SiNx etch, oxide etch, metal etch, wafer back-side clean and decontamination, pre-gate clean, batch spray clean or etch, recirculation immersion bath clean or etch, Process Equipment recipe creations, inspections, defects control, and standard Thin Film related metrology such as ellipsometry, sheet resistance, surface defects scans, or profilometry.