Job Description
Foxconn Wisconsin is seeking an ICT TEST ENGINEER that will work as part of the Testing team to manage and develop processes and test capacity for printed circuit boards. Once a part of the team, you will be responsible for a wide variety of tasks within the testing department in a production environment and have the opportunity to display critical thinking skills to expand your career in Smart Manufacturing.
The ICT TEST ENGINEER will develop plans for processes and test capacity utilization for Surface Mount Lines and assist this Testing Department as needed.
JOB RESPONSIBILITIES INCLUDE:
Develop and setup test environment, test plans, cases & processes for various PCBA products, ensure all test requirements are successfully implemented and executed.
Develop plans for processes and test capacity utilization for Surface Mount Lines.
Manage test programs for ICT and Develop Flying probe programs
Train and develop operators on utilizing test equipment.
Provide technical support for SMT operations on testing and help develop optimum test processes.
Support test engineering validation for new PCBA products and prepare detailed NPI report/recommendation for customer.
Tracks daily repairs and downtime of production test equipment, analyze data and recommend solutions/countermeasure for improving test efficiency.
Assures test readiness and customer satisfaction by reviewing current test equipment/facilities against current and future test requirements and anticipates and communicates required improvement to team leader.
Coordinate with vendor and procurement team on procuring necessary Fixtures/tools for test setup.
Troubleshoot electronic PCBs and assemblies and recommend design changes.
Coordinate with Maintenance team and drive Preventative Maintenance program on test equipment.
Act as a technical resource for daily product test execution by promptly responding to line-machine requests from A-Techs, providing solutions or engaging external resources for additional support.
Actively participate in associated new project’s PFMEAs and New Product Introduction.
Other Duties as assigned
EDUCATION REQUIREMENTS AND IDEAL EXPERIENCE INCLUDES:
Bachelor’s Degree in Engineering (Electrical or related field)
0-2 year’s minimum experience in printed circuit board assembly processes, methodologies, standards, and best practices
Knowledge and experience of SMT process as ICT and Flying Probe
Practical knowledge and ability to apply test engineering principles, techniques, theories, concepts, industry practices, regulations, and policies
Electrical Engineering working knowledge of electronic equipment, pneumatic and mechanical test equipment, specifications and test procedures
Must have excellent problem-solving skills and possess good analytical, verbal and written communication skills
Must demonstrate flexibility, self-direction, and self-discipline to plan and accomplish objectives and meet deadlines with limited supervision
Exhibits a “Can-Do” attitude and actively seeks for solutions to problems
REASONS YOU SHOULD WORK AT FOXCONN WISCONSIN & FII USA, INC:
Comprehensive benefits package including medical, dental, and vision insurance coverage.
Basic life insurance and short-term disability coverage provided by employer.
Supplemental life insurance and long-term disability coverage options available.
401K with employer contribution.
Personal, Vacation, and Holiday paid time off for all full-time employees.
On-site clinic available for all employees.
Employees are continuously encouraged to learn and grow their careers in smart manufacturing.
ABOUT FOXCONN WISCONSIN & FII USA, INC:
Foxconn provides innovative design and Smart Manufacturing capabilities through Artificial Intelligence driven solutions. Dedicated to the expansion of AI-driven platforms, Fii USA, Inc centers around Cloud Based Computing, Big Data, High-Speed Networks, Automation, and Industry 4.0 methodology. Join an expansive network of professionals who embody an entrepreneurial spirit that works together within a company culture of shared mission!