PURPOSE:

\- To support new customer ramp up plan for SIPHOG production 2027 in clean room advance packaging assemblies (D/A W/B)

PRINCIPLE ACCOUNTABILITIES / DUTIES:

• Develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.
• Create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and active optical alignment equipment.
• Create, improve and document optical splicing and routing for fiber optics box build assembly.
• Lead root cause analysis and corrective actions for process excursions.
• Establish inspection criteria, acceptance procedures, and metrology methods for optical and photonic sub-assemblies.
• Design and order necessary tooling and ensure availability of all consumables

  PREVIOUS EXPERIENCE REQUIRED: (include experience required with specific software applications, equipment, or specific certifications and education requirements such as MSME, MSEE, APICS, etc)

  PREFERRED Qualifications (nice to have skills): 0-1 year experience in cleanroom manufacturing environment
  Understand principle for die bonding in microelectronics
  Basic Programming python, Excel for data analysis Education or Training: · BS degree required in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Optical Engineering, or Physics.