Join a growing custom SoC/ASIC development company at the forefront of advanced semiconductor technology. As a Senior Package Design Engineer, you’ll lead high-performance package substrate design with a focus on signal integrity (SI), power integrity (PI), and advanced routing. This is a hands-on technical role where your expertise directly impacts next-generation silicon solutions and contributes to a strong and expanding IP portfolio.

Why You’ll Love This Role

• Competitive pay: $190,000–$220,000 plus relocation support

• Work on outstanding, cutting-edge technology

• Join a growing company with significant proprietary IP

• Collaborative environment where everyone contributes

• Strong opportunity to learn, grow, and expand your technical depth

Your Day-to-Day

• Lead package substrate design and analysis, including SI/PI optimization and advanced routing

• Perform modeling and simulation using tools such as HFSS and ADS

• Drive high-speed package and PCB design solutions for technologies like SerDes, PCIe, LPDDR, and Ethernet

• Conduct time- and frequency-domain analysis including impedance, jitter, eye-diagram, and BER analysis

• Support PDN modeling, electro-thermal simulation, and reliability considerations

• Collaborate closely with layout engineers, marketing teams, and global design partners across the U.S. and overseas

• Contribute technical expertise during pre- and post-sales activities, helping translate customer requirements into optimized package solutions

What We’re Looking For

• BS in Electrical Engineering or related field (MS preferred)

• 8–10 years of experience in semiconductor package design

• Strong background in signal integrity and power integrity analysis, modeling, and simulation

• Experience with tools such as HFSS, ADS, Hspice, and Redhawk

• Expertise in high-speed package/PCB design and advanced interface standards

• Familiarity with electro-thermal simulation, PDN modeling, reliability analysis, and packaging/assembly rules

• Excellent communication, collaboration, and presentation skills

Ready to Apply?

If you’re an experienced Senior Package Design Engineer ready to shape high-performance semiconductor solutions and grow with an innovative SoC/ASIC company, this is your opportunity. Bring your SI/PI expertise, drive impact across global teams, and help build the next generation of advanced packaging technology. Apply today.