Define & deploy new component technology platforms in a cross-functional team for new product applications through testing, simulation, and prototypes.
Qualification of components for use in surface-mount electronic assembly manufacturing processes.
Use systematic problem-solving approaches to resolve quality/performance issues with suppliers, development, and manufacturing teams.
Lead testing and validation of components for high-reliability applications by performing use case-based electrical and environmental stress tests.
Implementation tasks include leading stage-gate approvals, documentation, supplier quality interface, characterization, verification, and ongoing sustaining support in a highly automated manufacturing environment.
Qualifications:
Education / Experience Requirements:
B.Sc. or M.Sc. in Electrical Engineering, Applied Physics, Material Science, or equivalent physical science, with evidence of high academic achievement
Excellent written and verbal communication skills; detail-oriented
3+ years of experience with chip-scale packaging, direct bump attach, copper pillar, and similar technologies
Detailed knowledge of wafer-level packaging, wire bond, encapsulation, and chip attach, their materials, and processes.
Detailed knowledge of IC packaging failure modes and root cause analysis techniques
Experience in high high-reliability electronics manufacturing environment
Experience with quality systems, including technical writing of quality-relevant documentation
Strong physics-based reasoning
Experience with failure analysis and root cause corrective action with suppliers
Demonstrated ability to conceive, implement, and complete engineering projects and experiments on schedule
Proficiency in standard office productivity software (Excel, Word, PowerPoint, etc.)
Demonstrated ability to interface across multiple functions/organizations (Quality, Manufacturing, Supply Chain, Test, Module/System development) to drive closure on projects.
Demonstrated creativity with multiple examples of innovative solutions. U.S. or EU Patents desirable.