+--------------------------------------+--------------------------------------+ | REPORTS TO: | Lead, ASICs Engineering | | | | | | | +--------------------------------------+--------------------------------------+ | LOCATION: | San Francisco Bay Area or Salt Lake | | | City | +--------------------------------------+--------------------------------------+ | OVERVIEW: | You will be part of the ASIC team | | | responsible for designing and | | | verifying ultrasound transducer | | | systems for medical imaging | | | applications. You will architect the | | | state-of-art acoustic sensing | | | systems and the ASICs required to | | | realize them. You will be expected | | | to take high level user requirements | | | and create a realizable system that | | | meets these goals. This will include | | | high level modeling of proposed | | | solutions, along with creating | | | detailed specifications of the | | | requirements. This is a highly | | | cross-functional role, and you will | | | work with others to identify | | | critical aspects of how the design | | | will interact with the overall | | | product. | +--------------------------------------+--------------------------------------+ | RESPONSIBILITIES: | - Work closely with the system | | | architects to design world-class | | | capacitive micromachined | | | ultrasound transducer chips and | | | IP blocks, which meet | | | performance, power and | | | area targets. | | | | | | - Design analog ASIC circuits for | | | CMOS back plane of capacitive | | | micromachined ultrasound | | | transducers with specifications | | | from the imaging system. | | | | | | - Master the procedures and tools | | | to simulate larger blocks of an | | | IC in layout, in simulation | | | (mixed-mode). | | | | | | - Master specification budgets of | | | larger building blocks | | | and sub-systems. | | | | | | - Collaborate with specialists | | | from cross-disciplinary design | | | and technology teams. | | | | | | - Assist testing team in unit | | | developing tests and methods for | | | performance characterization. | | | | | | - Assist with debug and bring-up. | +--------------------------------------+--------------------------------------+ | MINIMUM | - In-depth knowledge in IC design | | | for MEMS ultrasound | | EXPERIENCE: | transducer. This includes analog | | | circuits block design | | | and simulation, analog/digital | | | partition for | | | power optimization. IC or test | | | IC tape out experience | | | is preferred. | | | | | | - Strong electrical engineering | | | background in analog design. | | | | | | - Hands-on experience in | | | system-level design, | | | requirements documentation, and | | | IC architecture definition of | | | complex mixed-signal ASICs | | | | | | - Excellent programming skills in | | | Python, Matlab, C/C++, bash. | | | | | | - Analog design tool simulation | | | (spice, etc). | | | | | | - Familiarity with lab equipment | | | and debugging in the | | | lab environment. | | | | | | - Strong problem-solving skills | | | and be able work in a fast paced | | | collaborative environment. Be | | | able to adapt to priority and | | | task change quickly. Focus on | | | details and getting tasks | | | to completion. Independently | | | explore new innovative ideas. | | | | | | - Excellent written and verbal | | | communication skills and solid | | | teamwork skills. | +--------------------------------------+--------------------------------------+ | MINIMUM | - PhD or Master degree in | | | Electrical Engineering | | EDUCATION: | (Analog/Digital Signal | | | Processing/Circuit Design) or | | | related field. | +--------------------------------------+--------------------------------------+