Xenter is a technology in medicine company that is bringing medical devices to the digital age. Xenter is revolutionizing medicine by developing and launching smart/wireless guidewires and catheters that transmit data through a proprietary wireless network to our proprietary cloud that houses real time Physical Intelligence medical data.

Reports to: VP, Semiconductor Technology

Location: San Francisco Bay Area or Salt Lake City

Salary Range: $180K to $250K

Overview:

You will be the senior member of the ASIC team responsible for designing and verifying pressure sensing and ultrasound imaging systems for medical applications. You will architect the state-of-art acoustic sensing systems and design the ASIC chips to realize them. You will be expected to take high level user requirements and create a realizable system that meets these goals. This will include high level modeling of proposed solutions, along with creating detailed specifications of the requirements. This is a highly cross-functional role, and you will work with others to identify critical aspects of how the design will interact with the overall product.

Responsibilities:

· Work closely with the system architects to design world-class capacitive micromachined ultrasound transducer chips and IP blocks, which meet performance, power and area targets.

· Provide leadership to the ASIC design team to safeguard the success of the ASIC designs.

· Engage with cross-functional analog, digital, firmware, software, system architecture, technology, packaging, production test, and other teams to implement the new circuits and sub-systems and optimize the performance and power consumption.

· Design analog ASIC circuits, including TIA, Pulser, ADC etc. for CMOS back plane of capacitive micromachined ultrasound transducers with specifications from the imaging system.

· Develop and run high-level simulations to validate top-level integration

· Master specification budgets of larger building blocks and sub-systems.

· Assist testing team in developing testing methods, defining test-plans, and analyzing results.

· Assist with debug and bring-up.

Minimum Experience:

• Extensive experience on conceptualizing, designing, evaluating, and taking to production analog and mixed-signal circuits and sub-systems for sensing and measurement.

• In-depth knowledge in analog mixed signal circuit design for MEMS ultrasound transducer, including analog circuit block design for ADC/DAC, TIA, Pulser, bandgap and other references, biasing circuits, LDO regulators, amplifiers comparators, switched-cap circuits, oscillators, filters, etc.

• Solid understanding of and experience with precision analog design techniques including feedback and compensation, chopping, multifaceted element matching, frequency planning, trimming/calibration, and real-time adaptive algorithms

• Hands-on experience in system-level design, requirements documentation, and IC architecture definition of complex mixed-signal ASICs

• Deep knowledge of device physics as it applies to semiconductor devices and manufacturing technology

• IC or test IC tape out experience is preferred.

• Excellent skills in analog design tool simulation (spice, etc).

• Experience in working with production test engineers to develop and validate test plans and design for testability details

• Strong problem-solving skills and be able work in a fast paced collaborative environment. Be able to adapt to priority and task change quickly. Focus on details and getting tasks to completion. Independently explore new innovative ideas.

• Excellent written and verbal communication skills and solid teamwork skills.

Minimum Education:

• PhD or Master degree in Electrical Engineering (Analog/Digital Signal Processing/Circuit Design) or related field.