Daniel Huinda
Location
St. Louis, MO
Springfield, MO
Education
W
Washington University in St Louis
August 2023 - May 2027
expected degree
Bachelor's
major
Computer Science
Work Experience
T
The Boeing Company
Software Engineering Intern
St. Louis, MO, US
May 2025 - present
company
The Boeing Company
title
Software Engineering Intern
J
James M McKelvey Laboratory
Product Development Intern
St. Louis, MO, US
December 2024 - present
W
Washington University Robotics Club Rover Team
Technical Director AND Chief Software Engineer
St. Louis, MO, US
June 2024 - present
W
Washington University in St Louis
Teaching Assistant
St. Louis, MO, US
August 2024 - May 2025
Skills
Languages
ArabicChineseEnglishFrenchGermanRussianSpanish
Skills
AlgorithmsArtificial IntelligenceAssembly and InstallationBlockchainClient Server ModelsCommunication SkillsComputer DesignComputer EngineeringC (Programming Language)C++ (Programming Language)Creating PrototypesC Sharp (Programming Language)Cyber SecurityData ScienceData StructuresDesign of User InterfacesDistributed DevelopmentEmbedded ComputersEthicsField-Programmable Gate Array (FPGA)FriendlinessGeneration of LeadsGithubHuman-Computer InteractionInformation TechnologyJava (Programming Language)JavaScript (Programming Language)Manufacturing ProcessesMicrosoft WindowsMongoDB.NET FrameworkNoSQLObject-Oriented Software DevelopmentPIC MicrocontrollerProduct DesignProject ManagementPython (Programming Language)ReactJSReal Estate FinanceRegulatory ComplianceRemote AdministrationRemote Desktop ServicesResearch SkillsResource UtilizationRestful APIsRobotics Design and ProductionRobot Operating SystemSafety PrinciplesSoftware DebuggingSoftware EngineeringSoftware Version ControlSoftware Vulnerability ManagementSQL DatabasesStatic Program AnalysisSystem SoftwareSystemVerilogTeachingTesting SkillsTransmission Control Protocol (TCP)Visual Programming Language (VPL)Web Development